Details

Product Introduction


  • 1. High Control Precision

    • It supports 4-axis analog quantity, full closed-loop control, pulse direction, and EtherCAT bus control, adapting to different application scenarios. It can control stepping/servo/linear motors. The improved S-curve acceleration and deceleration algorithm and look-ahead control make the machine tool speed faster and more stable. It is designed for high-precision equipment and can achieve fast and good processing of small circles.

  • 2. Fast Computing Speed

    • The QLC-420 control platform adopts a digital processing unit with super computing power and an extremely short servo cycle, which is suitable for high-speed and high-precision digital motion control.

  • 3. Ethernet Port Communication

    • It uses 100/1000M Ethernet for communication, which is fast and stable. There is no need to install driver programs. The control system operates independently and is not affected by industrial computer failures, making the operation of machine tool equipment systems more stable.

  • 4. Large Data Storage Capacity

    • The QLC-420 is equipped with relatively large memory and can process large amounts of data at one time, which is very suitable for high-speed and high-precision motion control with large data throughput.

  • 5. Provide a Complete Set of Mature Application Control Software

    • SPCut, see P09; QLCut, see P10.

  • 6. Other Features

    • Supports gantry dual drive.

    • Supports position comparison and triggering.

    • Supports pulse synchronous output (PSO), which can be used for energy control in the laser industry, improving cutting quality. It is very suitable for the control of automation equipment and has powerful online analysis and debugging software, making machine adjustment easy.

Typical Application Fields of the Product


The QLC-420 and its supporting software are very suitable for automation equipment fields such as steel sheet/sheet metal cutting, ceramic/sapphire/glass cutting and slicing, wafer cutting and slicing, aluminum substrate cutting, large-area light guide plate marking, two-dimensional code detection, and printing machines.


Parameter

Main Applications:
Sapphire glass cutting, full-screen cutting, SMT laser stencil cutting/micropore, ceramic cutting/hole/rotary cutting, precision processing of mobile phone film cutting, etc.

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